ABU DHABI / WAM President His Highness Sheikh Mohamed bin Zayed Al Nahyan today received ...
Read More »Intel to build $7 billion chip facility in Malaysia
Bloomberg Intel Corp is spending $7.1 billion on new chip packaging facilities in Malaysia, a major investment to ramp up its global footprint and address a crippling global chip shortage it expects to persist until 2023. The company is earmarking more than 30 billion ringgit towards expanding its capacity in the country, Chief Executive Officer Pat Gelsinger told reporters. ...
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